C10200 Oxygen Free Copper sheet/plate/strip (CDA 102)

C10200 Oxygen-Free Copper in the form of sheets or plates is utilized in various applications where high electrical conductivity, thermal conductivity, and corrosion resistance are crucial.
Desciption

Here are some key aspects related to C10200 Oxygen-Free Copper sheets/plates:

  1. Composition: C10200 copper has a minimum copper content of 99.95%. The manufacturing process involves reducing oxygen content to enhance electrical conductivity.

  2. High Conductivity: C10200 copper sheets/plates exhibit high electrical conductivity, making them suitable for applications where efficient electrical transmission is essential.

  3. Thermal Conductivity: In addition to electrical conductivity, C10200 copper also demonstrates excellent thermal conductivity. This property is beneficial in applications where efficient heat transfer is required.

  4. Corrosion Resistance: While not as corrosion-resistant as some other metals like stainless steel, C10200 copper still has good resistance to corrosion in various environments.

  5. Applications of Sheets/Plates:

    • Electrical Components: C10200 copper sheets/plates are commonly used in electrical components, such as bus bars, electrical contacts, and circuit boards, where high conductivity is crucial.
    • Heat Exchangers: The combination of high thermal conductivity and formability makes C10200 copper sheets suitable for use in heat exchangers and other heat transfer applications.
    • Decorative Elements: Copper sheets are also used for decorative purposes due to their attractive appearance and corrosion resistance.
    • Roofing and Cladding: Copper sheets are employed in roofing and architectural cladding due to their durability and corrosion resistance.
  6. Annealing: Similar to other forms of C10200 copper, sheets and plates can undergo annealing processes to further improve their electrical conductivity by optimizing the crystal structure.

  7. Availability: C10200 copper sheets and plates are available in various thicknesses and sizes to meet specific application requirements.

Specifications

End Product Specification
Plate AMS 4501, ASME SB152, ASTM B152, SAE J463, J461
Plate, Clad ASTM B432
Sheet AMS 4501, ASME SB152, ASTM B152, SAE J461, J463
Sheet, Clad ASTM B506
Sheet, Printed Circuits ASTM B451
Strip AMS 4501, ASME SB152, ASTM B152, SAE J461, J463
Strip, Clad ASTM B506
Strip, Printed Circuits ASTM B451

chemical properties

CU O
Min/Max 99.95 min 0.001
Nominals - -

Mechanical behavior
TEMPER SECT. SIZE COLD WORK TYPE MIN TEMP TENSILE STRENGTH YS
0.05% UL
YS
0.02% OFFSET
YS
0.005% OFFSET
ELONG. RH
B
RH
C
RH
F
RH
30T
VH
500
BH
500
BH
3000
SHEAR
STRGTH
FATIGUE
STRGTH
IZOD
IMPACT
STRGTH
- in. % - F ksi ksi ksi ksi % B C F 30T 500 500 3000 ksi ksi ft-lb
- mm. - - C MPa MPa MPa MPa - - - - - - - - MPa MPa J
Flat Products
H02 0.04 68 42 36 - - - - - - - - - - 26 13
H02 1 0 TYP 20 290 248 - - 14 40 - 84 50 - - - 179 90 0
M20 0.25 68 32 10 - - - - - - - - - - 22 -
M20 6.35 0 TYP 20 221 69 - - 50 - - 40 - - - - 152 - 0
H04 0.25 68 50 45 - - - - - - - - - - 28 -
H04 6.35 0 TYP 20 345 310 - - 12 50 - 90 - - - - 193 - 0
H10 0.04 68 57 53 - - - - - - - - - - 29 -
H10 1 0 TYP 20 393 365 - - 4 62 - 95 64 - - - 200 - 0
H01 0.04 68 38 30 - - - - - - - - - - 25 -
H01 1 0 TYP 20 262 207 - - 25 25 - 70 36 - - - 172 - 0
H00 0.04 68 36 28 - - - - - - - - - - 25 -
H00 1 0 TYP 20 248 193 - - 30 10 - 60 25 - - - 172 - 0
OS025 0.04 68 34 11 - - - - - - - - - - 23 11
OS025 1 0 TYP 20 234 76 - - 45 - - 45 - - - - 159 76 0
H04 1 68 45 40 - - - - - - - - - - 26 -
H04 25.4 0 TYP 20 310 276 - - 20 45 - 85 - - - - 179 - 0
OS050 0.25 68 32 10 - - - - - - - - - - 22 -
OS050 6.35 0 TYP 20 221 69 - - 50 - - 40 - - - - 152 - 0
H00 0.25 68 36 28 - - - - - - - - - - 25 -
H00 6.35 0 TYP 20 248 193 - - 40 10 - 60 - - - - 172 - 0
H04 0.04 68 50 45 - - - - - - - - - - 28 -
H04 1 0 TYP 20 345 310 - - 6 50 - 90 57 - - - 193 - 0
H08 0.04 68 55 50 - - - - - - - - - - 29 14
H08 1 0 TYP 20 379 345 - - 4 60 - 94 63 - - - 200 97 0
H01 0.25 68 38 30 - - - - - - - - - - 25 -
H01 6.35 0 TYP 20 262 207 - - 35 25 - 70 - - - - 172 - 0
M20 0.04 68 34 10 - - - - - - - - - - 23 -
M20 1 0 TYP 20 234 69 - - 45 - - 45 - - - - 159 - 0
OS050 0.04 68 32 10 - - - - - - - - - - 22 -
OS050 1 0 TYP 20 221 69 - - 45 - - 40 - - - - 152 - 0

physical properties

PRODUCT PROPERTY US CUSTOMARY METRIC
Coefficient of Thermal Expansion 9.4 . 10 6? per å¡F (68-212 F) 16.9 . 10 6? per å¡C (20-100 C)
Coefficient of Thermal Expansion 9.6 . 10 6? per å¡F (68-392 F) 17.3 . 10 6? per å¡C (20-200 C)
Coefficient of Thermal Expansion 9.8 . 10 6? per å¡F (68-572 F) 17.6 . 10 6? per å¡C (20-300 C)
Density 0.323 lb/in3 @ 68 F 8.94 gm/cm3 @ 20 C
Electrical Conductivity 101%IACS @ 68 F 0.591 MegaSiemens/cm @ 20 C
Electrical Resistivity 10.3 ohms-cmil/ft @ 68 F 1.71 microhm-cm @ 20 C
Melting Point Liquid US 1981 F 1083 C
Melting Point Solid US 1981 F 1083 C
Modulas of Elasticity in Tension 17000 ksi 117000 MPa
Modulas of Rigidity 6400 ksi 44130 MPa
Specific Gravity 8.94 8.94
Specific Heat Capacity 0.092 Btu/lb/å¡F at 68 F 393.5 J/kg . å¡K at 293 K
Thermal Conductivity 226.0 Btu . ft/(hr . Ft2 . å¡F) at 68 F 391.1W/m . å¡K at 20 C
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